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APEX Expo 2026: Awards, Innovation & Unified Programming

APEX Expo 2026 in Anaheim, California delivered exactly what the electronics manufacturing community needed: energy, investment, and momentum. For Data I/O, it was one of our strongest show appearances in recent memory, marked by meaningful conversations, a prestigious industry award, and growing excitement around where our unified programming platform is headed.

At the show, we showcased the full depth of our unified programming strategy, connecting semiconductor programming from design and NPI through volume production and beyond. Here’s a look at what made the show so memorable.

LumenX2 Earns the 2026 NPI Award for Breakthrough in Electronics Programming

The highlight of the show came during the Circuits Assembly NPI Awards ceremony, where Data I/O was honored with the 2026 NPI Award in the Breakthrough in Electronics category for the LumenX2 platform. The award was presented by Mike Buetow, President of the PCEA (Printed Circuit Engineering Association), and accepted by our team at the show.

Apex Expo NPI Award 01

 (Pictured left to right: Monty Reagan, William Wentworth, Jennifer Higgins, and Mike Buetow, President of the PCEA (Printed Circuit Engineering Association), who presented Data I/O with the recognition at APEX Expo in Anaheim.) 

 

This recognition is an important validation of what the LumenX2 platform represents: next-generation programming performance designed for today’s most complex device requirements. The platform supports UFS, eMMC, microcontrollers, and secure elements, delivering fast verify speeds and tool-less changeovers that help manufacturers improve quality and reduce cost.

Read the full press release: Data I/O’s LumenX2 Platform Earns 2026 NPI Award for Breakthrough in Electronics Programming

Unified Programming Platform on Display

Throughout the four-day show, visitors experienced the full breadth of our unified programming platform, firsthand how the same programming environment carries validated jobs from engineering and NPI directly into high-volume production without requalification.

Solutions on display included:

  • LumenX2-M4: Next-generation manual programmer with expanded device support and faster programming performance

  • LumenX-M8: Award-winning manual programmer for design and NPI

  • FlashCORE III-M4: Trusted performance and scalability for NPI and preproduction workflows

  • PSV Family: High-speed automated programming systems for volume production, including the PSV7000, delivering flexibility and scalability ideal for programming high-density UFS memory and PSV5000, ideal for low to medium volume applications.

  • ConneX: Software for MES integration, traceability, and process analytics

The conversations at the booth reflected a market in motion. As Bill noted in his interview with What’s New in Electronics, the quality of engagement at the show was higher than ever:

“The conversations have been much more meaningful. You can tell the climate’s changed a little bit, and people are investing again.”

 

CEO Bill Wentworth on Growth, AI, and What’s Next

On day two of the show, Bill Wentworth sat down with Cliff Saunders of What’s New in Electronics for a candid conversation about Data I/O’s transformation, the broader market climate, and what manufacturers can expect from us in the year ahead.

Bill shared that 2025 was a year of deliberate investment, even when the market slowed. “When things aren’t that busy, you can think through decisions, try them out, and not have a negative effect on the business,” he explained.

That investment extended to internal operations, including a significant push into AI-assisted software development that has accelerated bug resolution and improved productivity across the engineering team.

On the business model side, Bill previewed new service offerings expected to roll out in the coming months, including CapEx-based programming models and contractual revenue structures that give customers greater flexibility.

“That’s always been the game plan: CapEx, services, and programming at test. Those are the three major intersection points for data provisioning,” he said. His outlook for 2026: “This is the year for return to growth. I’m seeing clear line of sight to that.”

 

Extending the Unified Programming Platform into Security Provisioning

One of the most significant conversations happening at the show and across the industry is how to build security into electronic products from the earliest stages of design, rather than treating it as an afterthought in production.

Our recently announced collaboration with IAR, the global leader in embedded development software tools, directly addresses this need. By combining IAR’s expertise in embedded security definition with Data I/O’s proven semiconductor preprogramming technology, the two companies are delivering a seamless workflow that extends secure provisioning from embedded design all the way through mass production manufacturing.

This integration enables OEMs worldwide to:

  • Design security in from the start with the IAR toolchain, then transfer securely into manufacturing on Data I/O manual and automated systems
  • Move production anywhere in the world securely, with consistent security provisioning across global manufacturing sites
  • Reduce development time through combined algorithm libraries that accelerate device support
  • Maintain complete traceability with ConneX software for device-level tracking throughout the entire security provisioning process

As government regulations and industry standards increasingly mandate robust security measures for electronic products, this partnership fills a critical gap in the unified programming platform story, closing the loop between embedded design and production in a way that minimizes exposure to threat actors and protects intellectual property at every step.

 

ConneX and the Road Ahead

Conversations at the show also generated real excitement around upcoming developments in our ConneX software platform. ConneX is the connective tissue of the unified programming platform, integrating with factory MES systems to enable real-time monitoring, job management, and end-to-end traceability across every stage of the supply chain.

We’re not ready to share all the details just yet, but a meaningful ConneX release is on the horizon, one that will bring deeper analytics, improved integration capabilities, and enhanced support for the security provisioning workflows we’re building with IAR. Stay tuned.

 

Thank You, Anaheim

APEX Expo 2026 reinforced something we already believe: the manufacturers who invest in a unified programming platform, one that connects NPI to production, design to security provisioning, and manual to automated workflows, are the ones best positioned to compete in a fast-moving global market.

Thank you to everyone who stopped by, asked sharp questions, and helped make this one of our most engaging shows yet. The energy we felt in Anaheim is driving everything we’re building for the months ahead.

We’d love to continue the conversation.

 

Ready to See the Unified Programming Platform in Action?

Ready to see the unified programming platform in action? Connect with our team to schedule a demo or consultation and discover how a unified strategy can power your next product launch.

 

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Overcoming Semiconductor Supply Chain Challenges

The semiconductor supply chain is a cornerstone of modern electronics manufacturing, but it’s not without its challenges. For many original equipment manufacturers (OEMs) and electronics manufacturers, supply chain inefficiencies like errors in preprogrammed parts and long lead times can disrupt operations and derail Just-in-Time (JIT) manufacturing goals. These issues create ripple effects across production lines, driving up costs and threatening quality.

For OEMs navigating these challenges, a unified preprogramming platform offers a transformative solution.

 

 

The Challenges OEMs Face

The semiconductor supply chain is inherently complex, requiring precision and reliability at every stage. Yet, many OEMs find themselves grappling with:

  • Errors in preprogrammed parts from outside providers: Inconsistent programming leads to compatibility issues and downstream disruptions.
  • Frequent Code Changes: software changes during the development to NPI and volume production can lead to delays and rework in manufacturing.
  • Inconsistent quality from suppliers: Relying on external vendors often results in varying standards that impact production.
  • Long lead times: Delays in receiving preprogrammed devices can throw off JIT schedules, increasing inventory costs and affecting delivery timelines.

These challenges don’t just affect manufacturing efficiency; they can erode customer trust, compromise competitiveness and time to market. Addressing them is essential for any OEM striving to meet high standards of quality and speed.

 

The Power of a Unified Preprogramming Platform

What if you could streamline your supply chain with a single, cohesive preprogramming solution that works in each stage of your semiconductor preprogramming supply chain? A unified preprogramming platform provides that opportunity, enabling OEMs to:

  • Validate programming early: By integrating manual programming systems into the design process, engineers can catch issues before they escalate and trust that the programming results will be consistent and reliable during NPI and volume production.
  • Achieve seamless transitions: A unified programming platform ensures programming jobs are seamlessly transferred from First Article validation to volume production without disruption.
  • Gain supply chain control: In-house preprogramming reduces reliance on external vendors, ensuring consistent quality and faster turnaround times.

A robust platform not only addresses immediate inefficiencies but also positions OEMs for long-term success, allowing them to adapt to future demands with confidence.

 

A Real-World Transformation

An OEM who is a global leader in access control faced significant challenges with their outsourced preprogramming supply chain, including frequent errors and lead time delays that undermined their JIT manufacturing goals. By partnering with Data I/O, they implemented a unified preprogramming platform that:

  • Reduced errors through early validation during the design and engineering phases.
  • Improved lead times by transitioning preprogramming in-house, reducing dependency on external suppliers.
  • Streamlined operations across the supply chain, from design validation to post-production rework.

The results were transformative, enabling them to align their processes with JIT principles and build greater confidence in their supply chain.

To learn more about this OEM’s journey and how they achieved these results, download our full case study.

 

Optimize Your Supply Chain

For OEMs striving to overcome supply chain challenges, a unified preprogramming platform can make all the difference. By reducing errors, improving lead times, and streamlining operations, this approach empowers manufacturers to achieve their goals without compromise.

 

Want to learn how to optimize your supply chain and enhance manufacturing efficiency?

Download our case study to discover how a unified preprogramming platform transformed a global OEM’s operations and how it can do the same for you.

 

 

 

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Highlights from IPC Apex Expo 2024

Highlights from IPC APEX Expo 2024

The Data I/O team recently participated in the IPC APEX Expo 2024, where we showcased our latest innovations in automated device programming systems and security provisioning platforms celebrated our 500th PSV system sold. We want to thank everyone who stopped by our booth to explore our offerings and engage in insightful conversations.

 

Booth Happenings

A group of professionals gather around a booth at a tradeshowData I/O showcased our industry leading programming technology that addresses industry 4.0 integration capabilities. Attendees learned why Data I/O is the industry leader for device programming and had the opportunity to explore the following products:

PSV Family Automated Device Programming Systems: Featuring the flagship PSV7000 model, and the entry-level option, the PSV3500. These systems offer advanced capabilities for high-performance and configurable device programming.

SentriX Security Provisioning Platform: Simplifying security for mass production with pre-configured deployment profiles. Attendees learned about how SentriX can simplify security provisioning using SentriX Product Creator.

ConneX  Service Software: Enable two-way integration between Data I/O's device programming systems and a factory MES system connected factories to enhance traceability, process analysis, and communication for improved efficiency and quality.

LumenX with VerifyBoost for ultra-fast UFS programming performance with up to 750 MB/sec read and 160 MB/sec write.

 

 

 

 

 

 

 

 

 

 

Global SMT TV Interview

During an interview with Trevor Galbraith from Global SMT & Packaging, Anthony Ambrose, CEO of Data I/O, shared his insights into the company's showcased equipment and market perspectives.

Ambrose highlighted, "We're showing our PSV7000 model, our flagship product, and our PSV3500, which is more entry-level for customers new to volume manufacturing." He also expressed pride in Data I/O reaching a significant milestone, stating, "We've announced our 500th PSV unit sold globally." Watch the full interview (7 minutes) below.

 

 

Panel Debate on ESG and Sustainability

Anthony Ambrose participated in a panel debate titled "ESG and sustainability in an EMS world," hosted by Trevor Galbraith. Alongside other industry experts, Ambrose discussed pressing issues surrounding ESG and sustainability in electronics manufacturing.

He emphasized Data I/O's commitment to ESG initiatives, stating, "For us, we've tried to meld the requirements of regulatory compliance and what customers demand so we can create one report that satisfies both needs."

Moreover, Ambrose highlighted Data I/O's efforts toward achieving net-zero emissions. "We're going effectively net-zero worldwide. We buy green power, we have carbon offsets for the natural gas, and we've gone to a policy of only electric or hybrid vehicles for company cars."

Ambrose’s insights provided valuable perspectives on the challenges and opportunities surrounding ESG practices in the manufacturing industry. Watch the entire panel discussion (10 minutes) below.

 

 

 

Data I/O's participation at IPC APEX Expo 2024 showcased its dedication to innovation and excellence in electronics manufacturing. The event provided a platform to engage with industry leaders, share insights, and demonstrate cutting-edge solutions.

Stay tuned for more updates and insights from Data I/O as we continue to drive advancements in automated device programming and security provisioning.

 

Contact our sales team to discover how our innovations can elevate your manufacturing processes.

 

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Insights from productronica 2023

productronica 2023, the industry’s largest conference and exhibition for electronics manufacturing, happens every two years in Munich, Germany. We are thrilled to share the latest updates from our recent appearance at the show. This event presented us with a tremendous opportunity to showcase our cutting-edge solutions and engage in insightful discussions on the future of electronics manufacturing. 

 

During the event, Data I/O President and CEO, Anthony Ambrose, actively contributed to the industry dialogue furthering the discussion on topics including environmental, social, and governance (ESG) performance for electronics manufacturers, the importance of securing IoT devices during the device programming process, and the role of device programming in the future of smart factories.  

 

Anthony Ambrose also presented at the productronica Forum during the event, “Simplifying Hardware-based IoT Security in the Electronics Supply Chain with Pre-defined Use Cases”, and "Industry 4.0: Integrating Offline Automated Device Programming into the Connected Factory for Production Efficiency, Traceability and Quality.” The latter topic sparked interest from IoT Insider, who scheduled time for a follow-up interview to explore the topic of Industry 4.0 and how device programming is going to be a strategic part of any smart factory to increase manufacturing efficiencies in production and traceability throughout the supply chain.  

 

Also announced at the event were the winners of the 2023 Global Technology Awards, an 18-year-running award ceremony hosted by Global SMT & Packaging. This celebration recognizes the companies and people achieving standards of excellence and driving the printed circuit assembly and packaging industries forward.  Data I/O was honored to receive the Device Programming Award for VerifyBoost™ for Lumen®X. 

 

As we delve into thought leadership at productronica 2023, the narrative continues to unfold. Data I/O’s role in shaping industry dialogues sets the stage for the dynamic conversations and impactful insights that emerged at this premier electronics manufacturing event. 

 

 

Industry Thought Leadership Discussions from productronica 

At the forefront of innovation and thought leadership, Data I/O, led by our CEO, Anthony Ambrose, actively participated in pivotal discussions at productronica 2023. As we explore the challenges and advancements in our field, these dialogues not only underscore Data I/O's dedication to excellence but also emphasize the collective mission of industry leaders—to propel our shared vision forward and drive meaningful change in the landscape of electronics manufacturing. 

 

Image of a panel discussion taken during productronica 2023Likely the most buzz-worthy topic at this year’s productronica show was the topic of ESG and sustainability. Trevor Galbraith of Global SMT and Packaging hosted a panel discussion on the topic and invited Mr. Ambrose to participate, along with other industry leaders. This engaging conversation shed light on the challenges electronics manufacturers face in improving ESG performance and promoting sustainability within supply chains. 

 

 

 

Trevor Galbraith of Global SMT speaks to Anthony Ambrose of Data I/O during productronica 2023In a brief yet insightful interview with Global SMT and Packaging, Mr. Ambrose also shared how customer needs influenced recent upgrades to our ConneX and VerifyBoost™ platforms. Jennifer Higgins, our Director of Corporate Marketing, provided valuable insights into Data I/O's ESG and sustainability strategy. We encourage you to explore the interview to gain further insights. Data I/O Upgrades ConneX and VerifyBoost™ Platforms (duration: 9 min.). 

  

 

 

 

Chloe O'Brien of WNIE speaks with Anthony Ambrose of Data I/O during productronica 2023Mr. Ambrose engaged in discussions with What's New in Electronics (WNIE) on secure device programming solutions with SentriX® and smart factory automation with ConneX. These conversations highlighted the importance of our solutions in ensuring secure programming and driving the future of smart factories. Data I/O on Secure Device Programming and Smart Factory Automation (duration: 5 min.). 

  

 

 

 

Anthony Ambrose, CEO of Data I/O speaks during a forum presentation at Productronica 2023IoT Insider also published an article about Mr. Ambrose’s forum presentation on Industry 4.0, emphasizing the integral role of device programming in the future of smart factories. The article underscores our commitment to shaping the industry's future. Device programming is integral to the future of smart factories (5-min. read). 

 

 

 

 

In wrapping up our experience at productronica 2023, we want to express our gratitude for the enriching discussions and exciting developments occurring during the event. The industry's recognition, exemplified by winning the 2023 Global Technology Award for the Device Programming category, fuels our commitment to excellence. 

The buzz generated at productronica echoes our mission — to bring electronic products to life, ensuring efficiency, security, and sustainability at every step. We are excited about the path ahead and look forward to sharing more updates and innovations as we continue to lead in device programming and security provisioning technology in the dynamic world of electronics manufacturing. 

 

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The Impact of Automotive Megatrends on Electronics Manufacturing, Flash Memory, and Programming Solutions

The Impact of Automotive Megatrends on Electronics Manufacturing and Flash Memory

Automotive megatrends, particularly those for connected and autonomous vehicles, are shaping the evolution of Flash Memory technologies and defining new programming requirements for automotive electronics manufacturing.

Automotive Electronics Growth Areas

Sources: KPMG,  Tektronix

 

The automotive electronics market is rapidly expanding, driven by five key megatrends: autonomous driving, infotainment, electrification, connectivity, and security. Industry analysts predict a threefold rise in demand for automotive semiconductors within the next eight years. These next-generation automotive applications require more storage for advanced features and event recording. UFS (Universal Flash Storage) has emerged as the preferred memory solution for IVI (In-Vehicle Infotainment) and ADAS (Advanced Driver Assistance Systems) applications. By 2025, over half of these automotive applications will utilize UFS devices, with the majority transitioning from eMMC to UFS by 2030. This shift is driven by a notable increase in programmable content with faster processing speeds for read/write operations, that cater to new requirements for advanced Flash Memory capabilities.

Growth in Global Semiconductor Market Value by Vertical Market

Storage Interface Trends Automotive

Source: Kioxia

 

Impact of Automotive Trends on System Architecture and Manufacturing Processes

Connected and autonomous cars are evolving from a hardware-centric to a software-centric design to support new complex features, communication protocols, and security requirements. This is driving changes to the automotive electronics architecture and new flash memory demands. Within the automotive electronics architecture, the shift from a traditional distributed architecture consolidates a multitude of distinct ECUs (Engine Control Units) into a domain-controlled architecture with fewer, more powerful ECUs to support enhanced performance, efficiency, safety, security, and connectivity. The domain architecture consolidates functions like ADAS and infotainment into distinct domains, streamlining resource usage. As vehicles progress towards a more integrated autonomous design, automotive electronics designs will continue transitioning to a centralized or zone-focused approach. This change necessitates advancements in semiconductor technology with higher performance and processing power, increased programmable content, additional storage, and bolstered security.

Storage Demands Future Automotive Systems

To meet these demands, automotive electronics are transitioning from eMMC to UFS, which offers faster data access and superior memory capacity. This shift poses challenges for manufacturing, including:

  • Maintaining throughput as file sizes grow.
  • Ensuring data retention for high-density Flash memory during x-ray and reflow processes.
  • Achieving a cost-effective transition from eMMC to UFS.

Strategic planning is essential for manufacturers to smoothly transition their programming process to support UFS and prepare for new requirements that optimize the manufacturing process and address evolving automotive industry needs.

 

To prepare for the impact of the automotive megatrends and the transition to UFS on your manufacturing and programming process consider these five key questions:

  1. Can Your Programming System Support UFS and Large Files?
    Ensure your programming technology can be easily upgraded to accommodate future production demands.

  2. What is Your Programming System’s Capacity and Can You Scale it?
    To combat declining production throughput due to growing file sizes, a programming system with high socket capacity enables manufacturers to expand production throughput without investing in a new programming system.

  3. Is your Supplier Innovative and Financially Stable?
    A financially stable supplier with a strong history of innovation is essential to reduce the risk of disruption to your manufacturing process when new semiconductor technology is introduced.

  4. Can Your Supplier Support New Automotive Security Requirements?
    New automotive architectures will drive new security provisioning requirements that will impact manufacturing. A programming system that can be upgraded to support security provisioning for hardware-based security by injecting security credentials into ECUs, DCUs, ZCUs, and CCUs into secure microcontrollers that support automotive cybersecurity standards and models like e-HSM (embedded Hardware Security Modules), SHE (Secure Hardware Extensions) and EVITA (E-safety vehicle intrusion protected applications) during manufacturing is critical.

  5. Does Your Supplier Collaborate on Technical Challenges?
    Your programming system supplier should have strong industry partnerships and provide co-developed best practices to maximize your quality and throughput.

  6. Is Support Easily Accessible?
    Manufacturers can’t afford delays in production due to equipment issues. Global service that is available 24/7 and remote support tools are vital to keep production running.

 

Introducing Data I/O: The Global Standard for Automotive Programming

Data I/O, a trusted supplier and partner to automotive electronics manufacturers, supports the latest automotive programming requirements with the PSV systems and LumenX programming technology. By doubling the programming performance for UFS devices and quadrupling the verification performance with VerifyBoost™, Data I/O streamlines the programming process and offers unmatched efficiency, quality, and cost benefits. In addition, Data I/O’s PSV systems can be upgraded to support security provisioning during the pre-placement programming process with SentriX, simplifying security provisioning at scale for the lowest total cost of ownership.

With the PSV systems, Data I/O provides industry-leading automated programming solutions, combining state-of-the-art robotic handling with LumenX Programming technology for unmatched throughput, programming performance, and socket density for the lowest total cost of ownership. With over 500 installations worldwide and a trusted supplier to 18 out of the top 20 automotive electronics suppliers, customers can upgrade their PSV system to support UFS seamlessly, ensuring flexibility and throughput at a great value. Are you ready to program UFS?

 

Data I/O’s Automotive Highlights:

  • UFS Programming Expertise: 18 of the top 20 automotive electronics manufacturers use Data I/O systems with over 50 automotive customers programming UFS.

  • Strategic Collaborations: Strong partnerships with leading Flash Memory & UFS suppliers.

  • Performance Excellence: Remarkable results including 10x UFS programming performance improvement.

  • Ongoing Innovation: A 30x performance improvement on LumenX in 8 years.

  • Lowest Total Cost of Programming: VerifyBoost™ for LumenX lowers the total cost of programming for UFS applications by up to 70%.

  • Committed R&D: 25% of sales are dedicated to research and development.

  • Expertise in Security Provisioning: Upgrade a PSV programming system to support hardware-based security during pre-placement programming.

  • Global Support: Over 60 engineers worldwide for consistent production support.

  • Future-Proof Solutions: Ensuring readiness for current and future demands.

 

At Data I/O, we’re dedicated to providing you with advanced solutions for automotive electronics programming challenges. Contact our knowledgeable team today to explore how Data I/O can help you prepare to program UFS in manufacturing and support new programming requirements for the automotive industry.

Are you ready to learn how you can prepare for new automotive programming requirements? Reach out to our experienced team today to discover how Data I/O's state-of-the-art programming technology can revolutionize your operations.

 

This blog was updated on September 25, 2023

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